- Update
Introduction
At CES, we proudly announced XMG NEO 16 (E25), featuring the powerful Intel Core Ultra 9 Processor 275HX and NVIDIA GeForce RTX 50 series GPUs. This refresh of last year’s XMG NEO 16 (E24) introduces a comprehensive internal redesign alongside cutting-edge features, including support for up to 96 GB of upgradeable DDR5 CSO-DIMM RAM at 6400 MT/s, PCI Express 5.0 x4 for the primary M.2 SSD slot, and further improvements to both air and liquid cooling systems. The laptop also boasts a stunning 16-inch, 16:10 display with a 300 Hz refresh rate, 500 nits brightness, and G-SYNC support. An optional Mini LED upgrade delivers 1000 nits brightness, 100% DCI-P3 coverage, and the same 300 Hz refresh rate. Enhanced display hinges and an updated aluminium chassis further improve durability and usability.


Additionally, XMG NEO 16 features upgraded connectivity options, such as Mini DisplayPort 2.1 (DP80), Thunderbolt 4 with Power Delivery up to 140 watts, and an SD Express-compatible full-size card reader. These upgrades complement the per-key RGB keyboard with anti-ghosting and N-key rollover, a large glass touchpad, and a 99.8 Wh battery. Despite its powerful hardware, the laptop maintains a compact design, weighing approximately 2.4 kg with the IPS display or 2.6 kg with the mini-LED option.
New motherboard design
XMG NEO 16 (E25) incorporates a novel approach to motherboard design. The CPU, RAM, and most I/O ports are housed on a separate mainboard, while the GPU resides on its own board with dedicated I/O ports.


Key clarifications:
- Boards are physically separate, but NOT strictly “modular”. Modularity implies a degree of self-enclosedness and universal compatibility, which this mainboard eco-system does NOT provide. The GPU board interacts with the mainboard not only through the modular PCIe bridge, but also through a shared cooling system, intertwined firmware, data signaling validation, and electromagnetic compatibility, all of which require precise integration.
- This design does NOT allow for post-purchase CPU or GPU upgrades. The separation of components into distinct boards is a manufacturing innovation aimed at providing flexibility during production. This does NOT translate into a system that users can reconfigure or upgrade post-purchase, NEITHER within NOR across generations.
- The XMG NEO 16 (E25) is not intended to be more “DIY-friendly” than previous XMG laptops. While the separate design optimizes our internal logistics and R&D processes, it is not engineered to facilitate additional end-user modifications or customizations. RAM and SSD storage remain upgradeable.
- The GPU board cannot function as a stand-alone dock or peripheral. GPU boards in this series are designed exclusively for integration within the laptop system. They rely on the system’s architecture and will not boot or function independently.
- Configurations sold are fixed and cannot be reconfigured after purchase. Customers should carefully select their desired specifications at the time of purchase, as the separate design does not support post-sale reconfiguration of components.
- Service and repair are simplified, but user modifications are NOT advised. The separate design allows professional servicing to replace defective components efficiently. However, the complexity of thermal module reassembly, particularly with materials like phase-change cooling pads (CPU and GPU) and thermal putty (VRAM and MOSFETs), makes user-driven modifications impractical and risky.
Advantages of the separate design
The new approach offers several distinct advantages:
- Flexibility in product offerings: Enables a diverse range of configurations by mixing and matching CPU and GPU SKUs with various chassis sizes and LCD panels.
- Improved logistics: Allows efficient shipping and inventory management, optimizing costs by separating high-value GPU boards from other components during transport.
- Simplified repairs: Only the affected board—mainboard or GPU board—needs to be replaced in case of defects, reducing downtime and repair costs.
Technical justifications for not allowing or supporting upgrades
The decision to prohibit user-driven upgrades is rooted in several technical and practical considerations:
- Unknown future requirements: The designs and needs of future CPU and GPU generations are unpredictable during the current product’s development. Even if the PCIe link remains physically compatible, changes in pin layouts, signal tolerances, power requirements, board dimensions, and other specifications will make upgrades unfeasible.
- Tight integration in power, signalling and firmware: In comparison with desktop PCs, laptops have stricter tolerances for power consumption, thermal performance, and a higher degree of cross-vendor integration. Features like NVIDIA Optimus (MSHybrid) further intertwine CPU and GPU operations, complicating compatibility. Even if physical compatibility were achieved, firmware mismatches and a lack of hardware debugging/validation for unsupported board combinations would result in unreliable or incomplete operation.
- Thermal management: Each system requires a custom-designed shared thermal module, including heat pipes, cold plates, and thermal pads or putty, all tailored to the specific dimensions and z-height of each CPU and GPU configuration. Even GPUs with similar board layouts may need adjustments to the thermal module and interface materials due to varying locations of components like VRAM and MOSFETs. Replacing or upgrading components would necessitate replacing the entire cooling solution to maintain thermal efficiency.
These technical constraints underline why user-driven upgrades are neither feasible nor supported.
Review of CES showcase and livestream
Within our interaction with media, including a livestream from CES with GizmoSlipTech, we have made efforts to emphasize that this design, while enabling more flexibility in manufacturing, does NOT facilitate post-purchase CPU or GPU upgrades.
Upon reviewing the 2 hour livestream, we concede that a few particular segments may have given cause to be interpreted with more ambiguity than what we intended.
Overview of statements
The following segments stand out:
Timecode / Statement | Remark |
(28:05) “So you’re talking about many different CPUs, GPUs, display combos – in the past, it would have been much harder to do this without your new modular motherboard.” – “That is right, Brandon.” […] (31:06) “It allows us to be more flexible when it comes to what configurations we offer.” | The discussion includes the ability to mix and match different CPU and GPU configurations during R&D and manufacturing. |
(31:12) “Now I want to make it clear to the audience – very important – that this does not mean that your laptop is necessarily upgradeable, right? This is primarily a manufacturing method of being able to provide lots of different configs, lots of different SKUs […]” | Statement by host emphasizes that this design is intended only for manufacturing flexibility and not for user-driven upgrades or reconfigurations. |
(34:43) “So we cannot -, we must refuse to imply that there will be a cross generation upgrade path right now, because we’re just taking the first steps with this eco-system, so all our board partners are very sensitive about promising, overpromising too much – it’s really right now about our internal logistics.” | Statement attempts to further reject even the implication of future-proofing or cross-generation upgrades for this system. |
(Emphasis added by editor.)
Clarification of statements
We wish to clarify statements made in the live-stream above.
- Context for “first steps”: The phrase “we’re just taking the first steps” may have unintentionally caused speculation. To clarify, future developments for this ecosystem, currently exclusive to the XMG NEO 16 (E25), will focus only on extending it to additional models and optimizing logistics. Due to the tightly integrated nature of laptop systems and the dependencies on multiple suppliers and stakeholders, no plans exist to expand this design for broader purposes beyond its current scope.
- Terminology adjustment: The term “modular mainboard” may inadvertently suggest universal compatibility, which this design does not offer. Due to the precise integration required for cooling, firmware, and signaling, we will avoid this terminology to prevent misinterpretation and instead call it “separate mainboard and GPU board”, or simply “separate boards”.
We hope these clarifications help to address any remaining ambiguities and reaffirm our commitment to transparency and setting realistic expectations for this innovative design approach.
Conclusion
The modular mainboard design in the new XMG NEO 16 is an exciting innovation that enhances our manufacturing capabilities and improves serviceability. However, it does not imply user-upgradeable components or forward compatibility. Customers are encouraged to select their desired specifications thoughtfully at the time of purchase to ensure the best possible experience.
For further inquiries, please contact our support team, visit us on Reddit or join our Discord server. Thank you for your support. We are looking forward to your feedback!